B560 AORUS utiliza un diseño térmico totalmente cubierto de alto rendimiento con disipadores de calor MOSFET de alta cobertura y un thermal pad grueso- que proporciona el mejor rendimiento de enfriamiento MOSFET para entusiastas- overclockers y jugadores.
Procesador
LGA1200 package:
1. 11th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors
2. 10th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors / Intel® Core™ i3 processors/ Intel® Pentium® processors / Intel® Celeron® processors*
* Limited to processors with 4 MB Intel® Smart Cache- Intel® Celeron® G5xx5 family.
3. L3 cache varies with CPU
Chipset
1. Intel® B560 Express Chipset
Memoria
1. 11th Generation Intel® Core™ i9/i7/i5 processors:
Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/
4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) /
3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz memory modules
2. 10th Generation Intel® Core™ i9/i7 processors:
Support for DDR4 2933/2666/2400/2133 MHz memory modules
3. 10th Generation Intel® Core™ i5/i3 /Pentium®/Celeron® processors:
Support for DDR4 2666/2400/2133 MHz memory modules
4. 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
5. Dual channel memory architecture
6. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
7. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
8. Support for Extreme Memory Profile (XMP) memory modules
Gráficos Integrados
Integrated Graphics Processor-Intel® HD Graphics support:
1. 1 x HDMI port- supporting a maximum resolution of 4096x2160@30 Hz
* Support for HDMI 1.4 version and HDCP 2.3.
2. 1 x DisplayPort- supporting a maximum resolution of 4096x2304@60 Hz
* Support for DisplayPort 1.2 version- HDCP 2.3
