El módulo de memoria de MARKVISION está organizado de 64 bits en un módulo de memoria de 260 pines- basado en componentes DDR4 FBGA de 8 bits por módulo. Está diseñado para su uso en aplicaciones que operan a velocidades de reloj de hasta 1500MHz y alcanza alta velocidad velocidades de transferencia de datos de hasta 3000 MHz.
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DDR4 functionality and operations supported as defined in the component data sheet
260-pin- socket type small outline dual in line memory module SO-DIMM
Fast data transfer rates: PC4-3000
VDD = 1.2V (typical)
VPP = 2.5V (typical)
VDDSPD = 2.2–3.6V
Nominal and dynamic on-die termination (ODT) for data- strobe- and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQgeneration and calibration
Dual-rank
On-board serial presence-detect (SPD) EEPROM
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Gold edge contacts
Halogen-free
Fly-by topology
Terminated control- command- and address bus
